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COB, GOB and LED Packaging Technology

A variety of product packaging processes has got advanced since the LED screen industry started, like DIP (direct insertion process), the earliest version, and SMD (surface mounting devices), COB (chip on board), and GOB (glue on board) technology.

09/05/2020

A variety of product packaging processes has got advanced since the LED screen industry started, like DIP (direct insertion process), the earliest version, and SMD (surface mounting devices), COB (chip on board), and GOB (glue on board) technology.

This article is about COB and GOB led technology. Over the process of developing a small pitch LED display, most manufacturers have been working on figuring out the best solution to achieve small pitch LED displays. Till now, there’s no 100% perfection whatever solutions or process we adopt, each of them has its own pros and cons.

COB packaging technology

COB refers to chip on board, a packaging technology to resolve the problem of LED heat dissipation. Compared to the process of DIP and SMD, COB LED technology allows space-saving, the packaging operation more simplifying, and the thermal management working efficiently. 

Using conductive or non-conductive adhesive to stick bare chip on the interconnect substrate. With wire bonding, it then makes an electrical connection. If the bare chip is exposed to the air, it will get polluted or damaged easily. The reason for sealing chips and wire bonding with adhesive is to protect and maintain normal function or performance of the chip, called soft packaging. This solution has merits of manufacturing efficiency, low thermal resistance, optical quality, applications, and costs. However, only time can tell whether COB packaging technology will survive in a small pitch LED screen market because the process detail still needs to be improved, the price of COB products is not to as competitive as other products’. It needs time to accumulate more experience for its optimization.

(1) Poor uniformity. It can cause the failure of separating light and color because there is no step-by-step selection of LED beads.

(2) Serious modulation. Inconsistent color may appear on the surface of the module since one complete module is composed of many unit boards.

(3) Poor Evenness. COB LED module comes with a harsh touch over its uneven surface resulting from the single light point gluing.

(4) Difficult to repair. Generally, it is suggested to send broken modules back to the manufacturer because it requires specific tools and equipment for maintenance, which means the expenses will be high. 

(5) High manufacturing cost. It’s common that there is a high defective rate of COB LED products, leading to higher costs than that of SMD small pitch LED products.

GOB packaging technology

Short for glue on board, GOB is developed to protect the LED lamps. With the protection of advanced transparent material packaged the base plate and LED unit board, GOB LED products can be used for various applications. The material comes with super high transparency as well as high efficient thermal conductivity. It enables the module to be moisture-proof, waterproof, dust-proof, UV resistant, and protected against knocks, which helps reduce LED lamp failure or dropping.

COB, GOB and LED Packaging Technology

GOB products allow 180 degrees of vertical and horizontal viewing angle. Compared to COB products, it costs less money on repairing with an easier way to maintain. Furthermore, it helps resolve problems of COB products, like inability to mix lamps, serious modulation, poor color uniformity, and poor surface flatness.

Three steps of producing GOB products:

(1) To select high-quality materials, like an LED lamp, IC scheme with ultra-high refresh ratio and LED chips

(2) After assembling, to test LED lamps for 72 hours is necessary to make sure the product is qualified to glue encapsulation.

(3) After glue encapsulation, to have another aging test for 24 hours.

After all, in this competition of small pitch LED packaging processes amongst SMD, COB, and GOB from Viewpointec company, after all, each has its own unique capabilities and limitations. Which one will stand out from the game? It depends on advanced technology and the extent of acceptance in the LED market. Let’s wait and see who will be the winner.


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